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Quality/Environment/Ethical Management
HOME > Quality/Environment/Ethical Management > Quality requirements
All employees shall adhere to the following guidelines to rovide satisfiable products to customers.
(internal and external)
Interflex Co., Ltd
No | Classification | System Name | Photo of System | Purpose | Features |
---|---|---|---|---|---|
1 | Shape measuring machine | non-contact 3D surface shape measuring machine (Contour and Form Measuring System) | ![]() |
observe protruding or dented surface of sample materials and analyze unevenness etc. with 3D shape | able to measure the 3D surface shape up to 0.1mm~270㎛ with no contact at high precision and high speed |
2 | Element analysis | FT-IR MICROSCOPE | ![]() |
analyze properties of finished products and raw/subsidiary materials, analyze surface features, analyze combination structure | applied to be useful for samples with very low absorbance |
3 | High magnification observation & element analysis device | SEM-EDX Electron Microscope(Scanning Electron Microscope & Energy Dispersive X-Ray Micro Analyzer) | ![]() |
observe the illumination of product surface and analyze elements of sample materials by quantitative and qualitative reviews | Provide high emission current at low Kv, 3kV of image resolution in 7nm SE mode, and BSE mode image of 10nm in 7nm SE mode |
4 | Bending Test | Bending Test | ![]() |
Measure changes in resistance through flexibility test of FPCB cable products | flexibility measuring device optimized for cable products as on-demand device manufactured by customers’ request. |
5 | Binding post-tensioning force assessment | ACF (Anisotropic Conductive Film) / FOG Bonder | ![]() |
Anisotropic Conductive Film (ACF) is used for the assessment with the film adhered between glass and sample materials | can be commonly used for various types of boards by installing the guide to Glass Stage |
6 | Environment test equipment | Thermal Shock Tester | ![]() |
assess adhesion of plating by thermal shock of applying heat and quick freezing to the plating materials of oil state | save temperature moving time by the individual bathtub method for heating and cooling and enable various tests from -70℃~ 200℃. |
7 | Environment test equipment | Thermal Shock Tester | ![]() |
assess adhesion of plating by thermal shock of applying heating and quick freezing to the plating materials of gas state | quick return to the original temperature after turning the heating or cooling fan mode: in 5 minutes, precise temperature control: controllability ±0.2℃. Distribution ±2.0℃ |
8 | Environment test equipment | Hot Oil Chamber Machine System | ![]() |
Assess heat resistance of laminating PCB products in oil state by coherence test | able to realize various tests by liquid state oil standing high temperature up to 250℃ |
9 | Bending Test | Folding Endurance Tester | ![]() |
Assess the physical properties of materials by applying temperature and load to the circuit board materials | have the system additionally fitted with temperature control system to meet extreme test conditions (fitted for -40℃~150℃) |
10 | Bending Test | FPC Flexural Endurance Tester | ![]() |
Assess accelerated life to determine the degree of degradation caused by mechanical fatigue of the circuit board materials | realize right, left and vertical movement (600~3,000RPM/min), additional temperature control system (fitted for -40℃~150℃) |
11 | Environment test equipment | Low Temperature Tester | ![]() |
Assessment of products environment in low temperature state that can occur while storing or transporting PCB products | highly durable confined type compressor is fitted along with quick cooling function inside the chamber by the minimum contact high efficiency evaporator |
12 | Environment test equipment | Press Cooker Tester | ![]() |
Assessment of product features based on moisture absorption and infiltration by long-term exposing PCB products under high temperature and pressure | fitted with the bias test oriented function that certifies a certain amount of voltage or signal |
13 | Environment test equipment | Ion Migration Tester | ![]() |
Assessment of electro-insulation among each patter of high temperature and high moisture states of PCB products | a device that can perform all three tests of ion migration test, electro-insulation resistance measurement, and electro-insulation properties test at the same time |
14 | Assessment device of communication properties | Impedance measuring device | ![]() |
assessment of Impedance resistance change rate according to coupon design | base jitter of less than max. 450fs RMS/ fitted to measure TDR bandwidth and S-parameter |
15 | Assessment device of rebounding properties | SPRING BACK & STATIC BENDING TESTER | ![]() |
Assess the phenomenon of decreased bending due to resilience to get back to the original condition after being bent | suitable to adjust the angle up to 180˚ and the speed within the range of 5~30cpm |
16 | Measurement device of surface energy | Contact Angle Analyzer | ![]() |
Measure the measurable value of energy of water drops placed on the surface of PCB products | Setup the 3 phase modes of manual, semi-automation, and automation, and measure the volume of the motion control drop by syringe movement per 0.1㎕ with accuracy |
17 | Wire bonding | Bond Tester | ![]() |
Assess bonding tensile strength in the form of destruction or non-destruction for reliability test of semiconductor device | Be fitted with plugging relay that helps step back setup or control, establish and maintain the shear height with accuracy of up to 1㎛ |
18 | Wire bonding | Wire Bonder | ![]() |
Assess tensile strength by Au Wire Bonding of PAD side of PCB products | Able to adjust the length of Au Wire and Roof Function per phase and able to measure in the mode of manual or automation |
19 | Environment test equipment | Temperature & Humidity Test Chamber | ![]() |
Assess moisture tolerance of products by maintaining the temperature or moisture within a certain range | Able to update the device as needed by the user and easy to clean as the condenser filter is readily detached or assembled on the left side of the chamber |
20 | Non-destructive testing device | CT X-RAY | ![]() |
Inspect a crack or openness if any by applying X rays in the state of non-destruction without destruction of PCB products |